Call for Papers: 2013 International Conference on Mechanical Engineering, Industrial Materials and Industrial Electronics (MII 2013)
http://www.mii-conf.org/index.htm

Date: September 1-2, 2013Place: Hong Kong
Book:"Applied Mechanics and Materials"Sponsors:TTP& IERI
Main topics:New Materials and Advanced Materials, Mechanical Engineering and Industrial Electronics
Email:Această adresă de email este protejată contra spambots. Trebuie să activați JavaScript pentru a o vedea. Tel:+86 13638690309 or 027-87772193

2013 International Conference on Mechanical Engineering, Industrial Materials and Industrial Electronics (MII 2013) will be held on September 1-2, 2013, Hong Kong.All accepted papers will be published on international journal"Applied Mechanics and Materials" and will be sent for index in the major academic databases, including EICompendex, Thomson ISI (ISTP) and other indexing services.

We look forward to meeting you in Hong Kong.